SSM3582ACPZ-R7 datasheet(11/58 Pages) AD

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Data Sheet

SSM3582A

Rev. A | Page 11 of 58

ABSOLUTE MAXIMUM RATINGS

Absolute maximum ratings apply at 25°C, unless otherwise noted.

Table 9.

Parameter

Rating

PVDD Supply Voltage

−0.3 V to +17 V

DVDD Supply Voltage

−0.3 V to +1.98 V

AVDD Supply Voltage

−0.3 V to +5.5 V

PGND and AGND Differential

±0.3 V

Digital Input Pins

FSYNC, BCLK, SDATA, SCL, SDA

−0.3 V to +5.5 V

Analog Input Pins

ADDRx

−0.3 V to +1.98 V

AVDD_EN

−0.3 V to +17 V

DVDD_EN

−0.3 V to +5.5 V

Electrostatic Discharge (ESD) Susceptibility

Human Body Model

2 kV

Charged Device Model

1 kV

Temperature Range

Storage

−65°C to +150°C

Operating

−40°C to +85°C

Junction

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the junction to air temperature, and θJC is the junction to

case temperature, and both are specified for the worst case

conditions, that is, a device soldered in a circuit board for

surface-mount packages.

Table 10. Thermal Resistance

Package Type

θJA1

θJC1

Unit

CP-40-7

1.1

°C/W

θJA and θJC are determined according to JESD51-9 on a 4-layer (2s2p) PCB

with natural convection cooling.

ESD CAUTION

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