MPC8313E datasheet(77/92 Pages) FREESCALE

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MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 1

Freescale Semiconductor

Thermal

Accurate thermal design requires thermal modeling of the application environment using computational

fluid dynamics software which can model both the conduction cooling and the convection cooling of the

air moving through the application. Simplified thermal models of the packages can be assembled using the

junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More

detailed thermal models can be made available on request.

Heat sink Vendors include the following list:

Aavid Thermalloy

603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech

408-749-7601

473 Sapena Ct. #12

Santa Clara, CA 95054

Internet: www.alphanovatech.com

Table 68. Thermal Resistance for TEPBGAII with Heat Sink in Open Flow

Heat Sink Assuming Thermal Grease

Air Flow

Thermal Resistance

(

°C/W)

Wakefield 53 x 53 x 2.5 mm Pin Fin

Natural Convection

13.0

0.5 m/s

10.6

1 m/s

9.7

2 m/s

9.2

4 m/s

8.9

Aavid 35 x 31 x 23 mm Pin Fin

Natural Convection

14.4

0.5 m/s

11.3

1 m/s

10.5

2 m/s

9.9

4 m/s

9.4

Aavid 30 x 30 x 9.4 mm Pin Fin

Natural Convection

16.5

0.5 m/s

13.5

1 m/s

12.1

2 m/s

10.9

4 m/s

10.0

Aavid 43 x 41 x 16.5 mm Pin Fin

Natural Convection

14.5

0.5 m/s

11.7

1 m/s

10.5

2 m/s

9.7

4 m/s

9.2

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