R1

VIN

GND

VOUT

GND

U1

Cff

Rcf

Css

Cout

GND

GND

VIN

VIN

Figure 9-39. Example Layout SIL Package

9.5.2.1 Thermal Consideration

The TPSM8281x module temperature must be kept less than the maximum rating of 125°C. The following are

three basic approaches for enhancing thermal performance:

• Improve the power dissipation capability of the PCB design.

• Improve the thermal coupling of the component to the PCB.

• Introduce airflow into the system.

To estimate the approximate module temperature of the TPSM8281x, apply the typical efficiency stated in this

data sheet to the desired application condition to compute the power dissipation of the module. Then, calculate

the module temperature rise by multiplying the power dissipation by the thermal resistance. For more details on

how to use the thermal parameters in real applications, see the application notes: Thermal Characteristics of

Linear and Logic Packages Using JEDEC PCB Designs and Semiconductor and IC Package Thermal Metrics.

The thermal values in Thermal Information used the recommended land pattern, shown at the end of this data

sheet, including the 18 vias as shown. The TPSM8281x was simulated on a PCB defined by JEDEC 51-7. The

9 vias on the GND pins were connected to copper on other PCB layers, while the remaining 9 vias were not

connected to other layers.

TPSM82810, TPSM82813

SLUSDN6D – SEPTEMBER 2019 – REVISED JUNE 2026

www.ti.com

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