www.ti.com

PACKAGE OUTLINE

C

2X 1.3

4X 0.65

10X (0.05)

6X 0.28

0.22

6X 0.54

0.46

2.4 MAX

4X 0.8 0.03

2X 1.75

4X 0.3 0.03

2X 0.9

2X 3.1

4X 0.79

0.71

4X 1.19

1.11

2X 1.15

2.4

B

3.1

2.9

A

4.1

3.9

(3.2)

(2.5)

4X (0.075)

uSIP - 2.4 mm max height

SIL0014B-C01

MICRO SYSTEM IN PACKAGE

4229075/A 09/2022

AREA

PIN 1 INDEX

NOTE 3

PICK AREA

0.08 C

0.1

C A B

0.05

C

1

10

SYMM

SYMM

5

6

11

12

13

14

(OPTIONAL)

PIN 1 ID

MicroSiP is a trademark of Texas Instruments

TM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Pick and place nozzle

1.3 mm or smaller recommended.

4. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance.

0.1

C A B

0.05

C

SCALE 3.000

www.ti.com

TPSM82810, TPSM82813

SLUSDN6D – SEPTEMBER 2019 – REVISED JUNE 2026

Copyright © 2026 Texas Instruments Incorporated

Submit Document Feedback

33

Product Folder Links: TPSM82810 TPSM82813