XM33C321ASPZR datasheet(43/122 Pages) TI2

43 / 122 page

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

fMCLK

CPUCLK, MCLK frequency with 2 flash wait state (3)

160

MHz

CPUCLK, MCLK frequency with 1 flash wait state (3)

110

CPUCLK, MCLK frequency with 0 flash wait state (3)

(1)

Connect CVDD ,CVBAT and CVCORE between VDD/VSS , VBAT/VSS and VCORE/VSS, respectively, as close to the device pins as

possible. A low-ESR capacitor with at least the specified value and tolerance of ±20% or better is required for CVDD ,CVBAT and

CVCORE.

(2)

The VCORE pin must only be connected to CVCORE. Do not supply any voltage or apply any external load to the VCORE pin.

(3)

The Flash and SRAM Configuration registers will need to be update to modify the wait states before switching the clock frequency.

7.4 Thermal Information

THERMAL METRIC(1)

PACKAGE

VALUE

UNIT

RθJA

Junction-to-ambient thermal resistance

LQFP-100 (PZ)

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

32.7

°C/W

ΨJT

Junction-to-top characterization parameter

0.6

°C/W

ΨJB

Junction-to-board characterization parameter

32.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

RθJA

Junction-to-ambient thermal resistance

LQFP-100 (PFA)

27.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

17.1

°C/W

RθJB

Junction-to-board thermal resistance

18.6

°C/W

ΨJT

Junction-to-top characterization parameter

0.3

°C/W

ΨJB

Junction-to-board characterization parameter

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

RθJA

Junction-to-ambient thermal resistance

LQFP-80 (PN)

40.51

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

12.17

°C/W

RθJB

Junction-to-board thermal resistance

23.66

°C/W

ΨJT

Junction-to-top characterization parameter

0.44

°C/W

ΨJB

Junction-to-board characterization parameter

23.51

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

RθJA

Junction-to-ambient thermal resistance

LQFP-64 (PM)

41.42

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

12.38

°C/W

RθJB

Junction-to-board thermal resistance

22.17

°C/W

ΨJT

Junction-to-top characterization parameter

0.42

°C/W

ΨJB

Junction-to-board characterization parameter

22.48

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

RθJA

Junction-to-ambient thermal resistance

VQFN-48 (RGZ)

24.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

12.8

°C/W

RθJB

Junction-to-board thermal resistance

7.2

°C/W

ΨJT

Junction-to-top characterization parameter

0.2

°C/W

ΨJB

Junction-to-board characterization parameter

7.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.8

°C/W

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MSPM33C321A, MSPM33C3219

SLASFB6A – DECEMBER 2025 – REVISED SEPTEMBER 2026

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