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ESDALC6V1M6 데이터시트(PDF) 5 Page - STMicroelectronics |
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ESDALC6V1M6 데이터시트(HTML) 5 Page - STMicroelectronics |
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5 / 11 page ![]() ESDALC6V1M6, ESDALC6V1-5M6 Package information 5/11 3 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 13. Footprint dimensions in mm [inches] Table 3. Package dimensions Ref Dimensions Millimeters Inches Min Typ Max Min Typ Max A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 D(1) 1. ± 0.1 mm 1.45 0.057 E(1) 1.00 0.039 e(2) 2. ± 0.05 mm 0.50 0.020 k0.20 0.008 L 0.30 0.35 0.40 0.012 0.014 0.016 E D A A1 e b k L N 1 1 2 2 0.50 [0.020] 0.25 [0.010] 0.65 [0.026] 0.30 [0.012] 1.60 [0.063] |
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