TDA7505 datasheet(36/38 Pages) STMICROELECTRONICS

36 / 38 page

Package information

TDA7505

36/38

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 14. LQFP100 (14x14x1.4mm) mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.600

0.0630

0.050

0.150 0.0020

0.0059

1.350

1.400

1.450 0.0531 0.0551 0.0571

0.170

0.220

0.270 0.0067 0.0087 0.0106

0.090

0.200 0.0035

0.0079

15.800 16.000 16.200 0.6220 0.6299 0.6378

13.800 14.000 14.200 0.5433 0.5512 0.5591

12.000

0.4724

15.800 16.000 16.200 0.6220 0.6299 0.6378

13.800 14.000 14.200 0.5433 0.5512 0.5591

12.000

0.4724

0.500

0.0197

0.450

0.600

0.750 0.0177 0.0236 0.0295

1.000

0.0394

0˚ (min.), 3.5˚ (typ.), 7˚(max.)

ccc

0.080

0.003

LQFP100 (14x14x1.40mm)

Low profile Quad Flat Package

0086901 D

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