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CS47048 데이터시트(PDF) 14 Page - Cirrus Logic |
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CS47048 데이터시트(HTML) 14 Page - Cirrus Logic |
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14 / 34 page ![]() CS47048 Data Sheet Audio SOC Processor Family 14 Copyright 2008 Cirrus Logic DS787A7 5.4 Power Supply Characteristics Note:Measurements performed under operating conditions) 5.5 Thermal Data (100-Pin LQFP with Exposed Pad) Parameter Min Typ Max Unit Operational Power Supply Current: VDD: Core and I/O operating1 VDDA: PLL operating current VDDA: DAC operating current (all 8 channels enabled) VDDA: ADC operating current (all 4 channels enabled) VDDIO: With most ports operating Total Operational Power Dissipation: Standby Power Supply Current: VDD: Core and I/O not clocked VDDA: PLLs halted VDDA: DAC disabled VDDA: ADC disabled VDDIO: All connected I/O pins 3-stated by other ICs in system Total Standby Power Dissipation: 1. Dependent on application firmware and DSP clock speed. - - - - - - - - - - 325 16 56 34 27 1025 140 1.2 100 10 0.4 620 - - - - - - - - - - mA mA mA mA mA mW μA μA μA μA μA μW Parameter Symbol Min Typ Max Unit Thermal Resistance (Junction to Ambient) Two-layer Board1 Four-layer Board2 1. To calculate the die temperature for a given power dissipation: Τ j = Ambient temperature + [ (Power Dissipation in Watts) * θja ] 2. To calculate the case temperature for a given power dissipation: Τ c = Τj - [ (Power Dissipation in Watts) * ψ jt ] Note:Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the top & bottom layers. Note:Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the top & bottom layers and 0.5-oz. copper covering 90% of the internal power plane & ground plane layers. θ ja - - 34 18 - - °C / Watt Thermal Resistance (Junction to Top of Package) Two-layer Board1 Four-layer Board2 ψ jt - - 0.54 .28 - - °C / Watt |
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