PCF2123TS datasheet(36/55 Pages) NXP

36 / 55 page

PCF2123_2

Product data sheet

Rev. 02 — 4 December 2009

36 of 55

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

10. Limiting values

[1]

With respect to VSS.

[2]

Pass level; Human Body Model (HBM) according to Ref. 7 “JESD22-A114”

[3]

Pass level; Machine Model (MM), according to Ref. 8 “JESD22-A115”

[4]

Pass level; latch-up testing, according to Ref. 9 “JESD78” at maximum ambient temperature

(Tamb(max) = +85 °C).

[5]

According to the NXP store and transport requirements (see Ref. 11 “NX3-00092”) the devices have to be

stored at a temperature of +8

°Cto+45 °C and a humidity of 25 % to 75 %. For long term storage products

deviant conditions are described in that document.

Table 43.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VDD

supply voltage

[1]

−0.5

+6.5

IDD

supply current

−50

+50

input voltage

[1]

−0.5

+6.5

output voltage

[1]

−0.5

+6.5

input current

−10

+10

output current

−10

+10

Ptot

total power dissipation

300

Tamb

ambient temperature

−40

+85

°C

VESD

electrostatic discharge

voltage

HBM

[2] -

±3000 V

[3] -

±300

Ilu

latch-up current

[4] -

200

Tstg

storage temperature

[5]

−65

+150

°C

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