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PCF2123TS 데이터시트(PDF) 48 Page - NXP Semiconductors |
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PCF2123TS 데이터시트(HTML) 48 Page - NXP Semiconductors |
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48 / 55 page ![]() PCF2123_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 4 December 2009 48 of 55 NXP Semiconductors PCF2123 SPI Real time clock/calendar 17. Packing information (1) Die marking code. Seal ring plus gap to active circuit ~18 µm. Wafer thickness 200 µm. PCF2123U/10: bad die are inked off. PCF2123U/12: bad die are marked in wafer mapping. Fig 35. PCF2123U/10 and PCF2123U/12 sawn wafer on film frame carrier 013aaa232 Saw lane ~18 µm 45 µm 70 µm ~18 µm detail X 1.449 mm 1.492 mm 1 1 1 1 X straight edge of the wafer 1.2+0 mm −0.1 73.68 mm 71.79 mm ∅ 193.50 mm 214.50 mm 214.50 mm 0.25 metal frame plastic film (1) |
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