SC18IM700_2

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 02 — 10 August 2007

17 of 22

NXP Semiconductors

SC18IM700

13. Package outline

Fig 18. Package outline SOT403-1 (TSSOP16)

UNIT

(1)

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.40

0.06

8

0

o

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT403-1

MO-153

99-12-27

03-02-18

D

Z

e

0.25

18

16

9

θ

A

Q

detail X

L

(A )

3

E

c

X

A

y

0

2.5

5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

A

max.

1.1

pin 1 index