SC18IM700_2

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 02 — 10 August 2007

20 of 22

NXP Semiconductors

SC18IM700

For further information on temperature profiles, refer to Application Note

AN10365

“Surface mount reflow soldering description”.

15. Abbreviations

16. Revision history

MSL: Moisture Sensitivity Level

Fig 19. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 15.

Abbreviations

Acronym

Description

ASCII

American Standard Code for Information Interchange

FIFO

First In, First Out

GPIO

General Purpose Input/Output

Inter Integrated Circuit bus

RX FIFO

Receive FIFO

TX FIFO

Transmit FIFO

UART

Universal Asynchronous Receiver/Transmitter

Table 16.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

SC18IM700_2

20070810

Product data sheet

-

SC18IM700_1

Modifications:

NXP Semiconductors.

• Table 4 “Internal registers summary”: added column “Default value”

SC18IM700_1

20060228

Product data sheet

-

-