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MPC8535E 데이터시트(PDF) 123 Page - Freescale Semiconductor, Inc |
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MPC8535E 데이터시트(HTML) 123 Page - Freescale Semiconductor, Inc |
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123 / 126 page ![]() Package Parameters for the MPC8535E FC-PBGA MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 123 5.1 Package Parameters for the MPC8535E FC-PBGA The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783 flip chip plastic ball grid array (FC-PBGA) without a lid. Package outline 29 mm × 29 mm Interconnects 783 Pitch 1 mm Minimum module height 2.23 mm Maximum module height 2.8 mm Solder Balls 96.5Sn/3.5Ag Ball diameter (typical) 0.6 mm |
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