MCP4716 datasheet(3/86 Pages) MICROCHIP

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DS22272A-page 3

MCP4706/4716/4726

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Voltage on VDD with respect to VSS ................ -0.6V to +6.5V

Voltage on all pins with respect to VSS

................................................................................ -0.3V to VDD + 0.3V

Input clamp current, IIK (VI < 0, VI > VDD, VI)

....................................................................................±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD)

....................................................................................±20 mA

Maximum input current source/sunk by SDA, SCL pins

........................................................................................2 mA

Maximum output current sunk by SDA Output pin

......................................................................................25 mA

Maximum current out of VSS pin ...................................50 mA

Maximum current into VDD pin ......................................50 mA

Maximum current sourced by the VOUT pin ..................40 mA

Maximum current sunk by the VOUT pin........................40 mA

Maximum current sunk by the VREF pin .........................40 µA

Package power dissipation (TA = +50°C, TJ = +150°C)

SOT-23-6 .......................................................452 mW

DFN-6 ..........................................................1098 mW

Storage temperature .....................................-65°C to +150°C

Ambient temperature with power applied

......................................................................-55°C to +125°C

ESD protection on all pins

.................................... ≥ 6kV (HBM)

.................................................................................... ≥ 400V (MM)

Maximum Junction Temperature (TJ) ......................... +150°C

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

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