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MPC5675K 데이터시트(PDF) 1 Page - Freescale Semiconductor, Inc |
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MPC5675K 데이터시트(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 140 page ![]() Freescale Semiconductor Data Sheet: Advance Information Document Number: MPC5675K Rev. 4, 04/2011 © Freescale Semiconductor, Inc., 2009–2011. All rights reserved. Preliminary—Subject to Change Without Notice This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. MPC5675K TBD MAPBGA–225 15 mm x 15 mm QFN12 ##_mm_x_##mm SOT-343R ##_mm_x_##mm PKG-TBD ## mm x ## mm 257 MAPBGA (14 x 14 mm) 473 MAPBGA (19 x 19 mm) 1 Overview This document provides electrical specifications, pin assignments, and package diagrams for the MPC5675K series of microcontroller units (MCUs). The MPC5675K microcontroller is a 32-bit embedded controller designed for advanced driver assistance systems with RADAR, CMOS imaging, LIDAR and ultrasonic sensors, and multiple 3-phase motor control applications as in hybrid electric vehicles (HEV) in automotive and high temperature industrial applications. A member of Freescale Semiconductor’s MPC5500/5600 family, it contains the Book E compliant Power Architecture technology core with Variable Length Encoding (VLE). This core complies with the Power Architecture embedded category, and is 100 percent user mode compatible with the original Power PC user instruction set architecture (UISA). It offers system performance up to four times that of its MPC5561 predecessor, while bringing you the reliability and familiarity of the proven Power Architecture technology. A comprehensive suite of hardware and software development tools is available to help simplify and speed system design. Development support is available from leading tools vendors providing compilers, debuggers and simulation development environments. MPC5675K Microcontroller Data Sheet 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.2 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.3 Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.4 Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2 Package pinouts and signal descriptions . . . . . . . . . . . . . . . . 23 2.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 73 3.3 Recommended operating conditions . . . . . . . . . . . . . . 75 3.4 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 77 3.5 Electromagnetic interference (EMI) characteristics . . . 79 3.6 Electrostatic discharge (ESD) characteristics. . . . . . . . 79 3.7 Static latch-up (LU). . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 3.8 Power Management Controller (PMC) electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 3.9 Supply current characteristics . . . . . . . . . . . . . . . . . . . 82 3.10 Temperature sensor electrical characteristics . . . . . . . 83 3.11 Main oscillator electrical characteristics . . . . . . . . . . . . 83 3.12 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 84 3.13 16 MHz RC oscillator electrical characteristics . . . . . . 85 3.14 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 85 3.15 Flash memory electrical characteristics . . . . . . . . . . . . 91 3.16 SRAM memory electrical characteristics . . . . . . . . . . . 93 3.17 GP pads specifications . . . . . . . . . . . . . . . . . . . . . . . . . 93 3.18 PDI pads specifications . . . . . . . . . . . . . . . . . . . . . . . . 95 3.19 DRAM pad specifications . . . . . . . . . . . . . . . . . . . . . . 100 3.20 RESET characteristics . . . . . . . . . . . . . . . . . . . . . . . . 106 3.21 Reset sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 3.22 Peripheral timing characteristics. . . . . . . . . . . . . . . . . 114 4 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 4.1 Package mechanical data. . . . . . . . . . . . . . . . . . . . . . 136 5 Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 6 Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 7 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . 143 |
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