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PCF8531U2DA 데이터시트(PDF) 6 Page - NXP Semiconductors

부품명 PCF8531U2DA
상세설명  34 x 128 pixel matrix driver Single-chip LCD controller and driver
PDF  51 Pages
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제조업체  NXP [NXP Semiconductors]
홈페이지  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8531U2DA 데이터시트(HTML) 6 Page - NXP Semiconductors

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PCF8531
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 6 — 16 May 2011
6 of 51
NXP Semiconductors
PCF8531
34 x 128 pixel matrix driver
[1]
Die size including saw lane of 70
μm.
6.2 Pin description
Fig 4.
Chip dimensions
Table 4.
Bonding pad dimensions
Pad
Size
Unit
pad pitch (minimum)
70
μm
bump dimensions
50
× 90 × 17.5 (±3)
μm
wafer thickness (excluding bumps)
381
μm
die size L
× W
12.14
× 1.86[1]
mm
001aag908
X
Y
L
pitch
W
PCF8531
Table 5.
Bonding pad description
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 2).
Symbol
Pad
X (
μm)
Y (
μm)
Description
-
1
5973.6
−821.7
dummy
-
2
5969.5
823.4
-
3
5899.5
823.4
-
4
5829.5
823.4
-
5
5479.5
823.4
-
6
5409.5
823.4
-
7
5059.5
823.4
-
8
4989.5
823.4
-
9
4639.5
823.4
-
10
4569.5
823.4
-
11
4219.5
823.4
-
12
4149.5
823.4
-
13
3799.5
823.4
-
14
3729.5
823.4
OSC
15
3449.5
823.4
oscillator input
[1]
VLCDSENSE
16
3169.5
823.4
voltage multiplier regulation input (VLCD) [2]



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