Note:

Leaching of the termination

Effective area at the termination might be lost if the soldering temperature and/or immersion time

are not kept within the recommended conditions. Leaching of the outer electrode should not ex-

ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,

shown below as mounted on substrate.

As a single chip

As mounted on substrate

7

Notes for proper soldering

7.1

Preheating and cooling

According to JEDEC J-STD-020D. Please refer to chapter 2.

7.2

Repair / rework

Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for

rework purposes.

7.3

Cleaning

All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning

solution according to the type of flux used. The temperature difference between the components

and cleaning liquid must not be greater than 100

°C. Ultrasonic cleaning should be carried out

with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-

lized surfaces.

7.4

Solder paste printing (reflow soldering)

An excessive application of solder paste results in too high a solder fillet, thus making the chip

more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive

strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be

applied smoothly to the end surface.

SMD disk varistors (CU varistors)

Automotive series

Page 22 of 30

Please read Cautions and warnings and

Important notes at the end of this document.