SC667201MMG3 datasheet(72/120 Pages) FREESCALE

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MPC5642A Microcontroller Data Sheet, Rev. 3.1

Freescale Semiconductor

Electrical characteristics

3.9

I/O pad current specifications

The power consumption of an I/O segment depends on the usage of the pins on a particular segment. The power consumption

is the sum of all output pin currents for a particular segment. The output pin current can be calculated from Table 21 based on

the voltage, frequency, and load on the pin. Use linear scaling to calculate pin currents for voltage, frequency, and load

parameters that fall outside the values given in Table 21.

18 Maximum leakage occurs at maximum operating temperature. Leakage current decreases by approximately

one-half for each 8 to 12 oC, in the ambient temperature range of 50 to 125 oC. Applies to analog pads.

19 Applies to CLKOUT, external bus pins, and Nexus pins

20 Applies to the FCK, SDI, SDO, and SDS pins

21 This programmable option applies only to eQADC differential input channels and is used for biasing and sensor

diagnostics.

Table 21. I/O pad average IDDE specifications

1 Numbers from simulations at best case process, 150 °C

Pad type

Symbol

Period

(ns)

Load2

(pF)

2 All loads are lumped.

VDDE

(V)

Drive/Slew

rate select

IDDE Avg

(mA)3

3 Average current is for pad configured as output only

IDDE RMS

(mA)

Slow

IDRV_SSR_HV

CC D

5.25

—

CC D

130

5.25

2.5

—

CC D

650

5.25

0.5

—

CC D

840

200

5.25

1.5

—

Medium

IDRV_MSR_HV

CC D

5.25

—

CC D

5.25

5.3

—

CC D

317

5.25

1.1

—

CC D

425

200

5.25

—

Fast

IDRV_FC

CC D

3.6

22.7

68.3

CC D

3.6

12.1

41.1

CC D

3.6

8.3

27.7

CC D

3.6

4.44

14.3

CC D

1.98

12.5

CC D

1.98

7.3

18.6

CC D

1.98

5.42

12.6

CC D

1.98

2.84

6.4

MultiV

(High swing mode)

IDRV_MULTV_HV CC D

5.25

—

CC D

5.25

6.1

—

CC D

117

5.25

2.3

—

CC D

212

200

5.25

5.8

—

MultiV

(Low swing mode)

IDRV_MULTV_HV CC D

5.25

3.4

—

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