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JT107MG48 데이터시트(PDF) 5 Page - Shenzhen Luguang Electronic Technology Co., Ltd |
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JT107MG48 데이터시트(HTML) 5 Page - Shenzhen Luguang Electronic Technology Co., Ltd |
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5 / 7 page ![]() http://www.luguang.cn Email: lge@luguang.cn SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. 5 7.STRUCTUAL CHARACTERISTIC L e a d W i r e Solder Ceramic Substrate M o l d R e s i n O v e r c o a t i n g Component Material Lead Wore Solder plating copper wire Mold Resin epoxy resin Solder High-melting solder (Sn98-Ag2) Ceramic Substrate Lead titanate-zirconate Over coating Clear Epoxy Resin 8. PACKAGE To protect the products in storage and transportation , it is necessary to pack them(outer and inner package).On paper pack, the following requirements are requested. 8.1 Dimensions and Mark At the end of package, the warning (moisture proof, upward put) should be stick to it. Dimensions and Mark (see below) |
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