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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32F051K6 데이터시트(PDF) 99 Page - STMicroelectronics |
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STM32F051K6 데이터시트(HTML) 99 Page - STMicroelectronics |
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99 / 104 page  Package characteristics STM32F051x 100/105 Doc ID 022265 Rev 3 Figure 38. UFQFPN32 recommended footprint 1. Drawing is not to scale. 2. Dimensions are expressed in millimeters. 7.2 Thermal characteristics The maximum chip junction temperature (TJmax) must never exceed the values given in Table 20: General operating conditions. The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max x ΘJA) Where: ● TA max is the maximum ambient temperature in °C, ● ΘJA is the package junction-to-ambient thermal resistance, in °C/W, ● PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), ● PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. |
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