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MPC8241EC 데이터시트(PDF) 32 Page - Freescale Semiconductor, Inc |
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MPC8241EC 데이터시트(HTML) 32 Page - Freescale Semiconductor, Inc |
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32 / 58 page ![]() MPC8241 Integrated Processor Hardware Specifications, Rev. 10 32 Freescale Semiconductor Package Description 5.2 Pin Assignments and Package Dimensions Figure 24 shows the top surface, side profile, and pinout of the MPC8241, 357 PBGA ZP package. Note that this is available for Rev. B parts only. Figure 24. MPC8241 Package Dimensions and Pinout Assignments (ZP Package) W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 SIDE VIEW BOTTOM VIEW 18X 4X 357X b TOP VIEW A2 A3 e 0.30 M C D A A1 D2 0.15 M C E E2 0.20 C A B 0.2 D1 E1 AB 0.25 C 0.35 C C NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSION b IS THE MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM C. DIM MIN MAX MILLIMETERS A --- 2.05 A1 0.50 0.70 A2 0.95 1.35 A3 0.70 0.90 b 0.60 0.90 D 25.00 BSC D1 22.86 BSC D2 22.40 22.60 e 1.27 BSC E 25.00 BSC E1 22.86 BSC E2 22.40 22.60 |
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