TSL2581, TSL2583

LIGHT-TO-DIGITAL CONVERTER

TAOS134A − JULY 2012

26

r

r

Copyright

E 2012, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

PACKAGE INFORMATION

PACKAGE CS

Six-Lead Chipscale

1750

500

BSC

1250

6

415

+ 20

710

+ 45

500

BSC

500

BSC

375

+ 30

375

+ 30

TOP VIEW

BOTTOM VIEW

END VIEW

6

PIN OUT

Lead Free

Pb

442

+ 10

442

+ 10

PHOTODIODE ARRAY

BOTTOM VIEW

SDA 6

INT 5

SCL 4

2 ADDR SEL

3 GND

8 Nominal

Array Area

C

of Photodiode Array Area

C

L

139 Nominal

PIN 1

PIN 1

NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is

± 25 μm unless otherwise noted.

B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).

C. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.

D. This drawing is subject to change without notice.

Figure 10. Package CS — Six-Lead Chipscale Packaging Configuration