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AFE032 데이터시트(PDF) 67 Page - Texas Instruments

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부품명 AFE032
상세설명  Power-Line Communications Analog Front-End
PDF  77 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI1 - Texas Instruments

AFE032 데이터시트(HTML) 67 Page - Texas Instruments

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35
33
31
29
27
25
23
21
19
17
15
0.5
1
1.5
2
2.5
Cu Thickness (oz)
Four-Layer PCB, PCB
Area = 4.32 in , 2 oz Cu
(Results are from thermal
simulations)
2
28
26
24
22
20
18
16
14
12
10
2
4
6
8
10
12
14
PCB Area (in )
2
THERMAL RESISTANCE vs BOARD AREA
Four-Layer PCB, 2 oz Cu
(Results are from thermal
simulations)
1
2
3
4
5
6
7
8
Number of Layers
36
34
32
30
28
26
24
22
20
THERMAL RESISTANCE vs NUMBER OF PCB LAYERS
PCB Area = 3 in , 2 oz Cu
(Results are from thermal
simulations)
2
AFE032
www.ti.com
SBOS669A – AUGUST 2013 – REVISED DECEMBER 2013
Increasing the number of layers in the PCB, using thicker copper, and increasing the PCB area are all factors
that improve the spread of heat. Figure 32 through Figure 34 show thermal resistance performance as a function
of each of these factors.
Figure 32. Thermal Resistance as a Function of
Figure 33. Thermal Resistance as a Function of
the Number of Layers in the PCB
PCB Area
Figure 34. Thermal Resistance as a Function of Copper Thickness
For additional information on thermal PCB design using exposed thermal pad packages, refer to Application
Reports Analog Front-End Design for a Narrowband Power-Line Communications Modem Using the AFE031
(SBOA130) and PowerPAD™ Thermally-Enhanced Package (SLMA002E) (both available for download at
www.ti.com).
Copyright © 2013, Texas Instruments Incorporated
Submit Documentation Feedback
67
Product Folder Links: AFE032



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