DocID024020 Rev 2

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M24C01/02-W M24C01/02-R M24C02-F

Package mechanical data

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Figure 15. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

1. Drawing is not to scale.

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 21. UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

Symbol

millimeters

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

A

0.550

0.450

0.600

0.0217

0.0177

0.0236

A1

0.020

0.000

0.050

0.0008

0.0000

0.0020

b

0.250

0.200

0.300

0.0098

0.0079

0.0118

D

2.000

1.900

2.100

0.0787

0.0748

0.0827

D2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

E

3.000

2.900

3.100

0.1181

0.1142

0.1220

E2 (rev MC)

–

1.200

1.600

–

0.0472

0.0630

e

0.500

–

–

0.0197

–

–

K (rev MC)

–

0.300

–

–

0.0118

–

L

–

0.300

0.500

–

0.0118

0.0197

L1

–

–

0.150

–

–

0.0059

L3

–

0.300

–

–

0.0118

–

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

–

0.080

–

–

0.0031

–

D

E

ZW_MEeV2

A

A1

eee

L1

e

b

D2

L

E2

L3

Pin 1

K

MC