| 전자부품 데이터시트 검색엔진 |
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SIM3U167 데이터시트(PDF) 13 Page - Silicon Laboratories |
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SIM3U167 데이터시트(HTML) 13 Page - Silicon Laboratories |
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13 / 18 page ![]() SiM3U167-B-GDI Rev. 1.1 13 53 46 PB1.9/TRACECLK –1765 1157 54 47 PB1.8/ETM3 –1765 1057 55 48 PB1.7/ETM2 –1765 957 56 49 VIO –1765 860 57 33,75 GND –1765 771 58 NA Reserved* –1765 680 59 50 PB1.6/ETM1 –1765 587 60 51 PB1.5/ETM0 –1765 487 61 52 PB1.4/TDI –1765 387 62 53 PB1.3/TDO/SWV –1765 287 63 33,75 GND –1765 191 64 54 PB1.2/TRST –1765 95 65 55 PB1.1 –1765 –5 66 56 PB1.0 –1765 –105 67 57 PB0.15 –1765 –335 68 33,75 GND –1765 –570 69 58 PB0.14 –1765 –1456 70 59 PB0.13 –1765 –1556 71 60 PB0.12 –1765 –1656 72 61 PB0.11 –1586 –1835 73 62 PB0.10 –1486 –1835 74 63 PB0.9 –1386 –1835 75 64 PB0.8 –1286 –1835 76 65 PB0.7 –1141 –1835 77 33,75 GND –985 –1835 78 66 PB0.6 –889 –1835 Table 3. Bond Pad Coordinates (Relative to Center of Die) (Continued) Physical Pad Number Example Package Pin Number (TQFP-80) Package Pin Name Physical Pad X (µm) Physical Pad Y (µm) *Note: Pins marked “Reserved” should not be connected. |
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