IO13RSB0 datasheet(30/210 Pages) MICROSEMI

30 / 210 page

ProASIC3 Flash Family FPGAs

Re vi s i on 15

2 - 25

I/O DC Characteristics

Table 2-27 • Input Capacitance

Symbol

Definition

Conditions

Min.

Max.

Units

CIN

Input capacitance

VIN = 0, f = 1.0 MHz

–

CINCLK

Input capacitance on the clock pin

VIN = 0, f = 1.0 MHz

–

Table 2-28 • I/O Output Buffer Maximum Resistances1

Applicable to Advanced I/O Banks

Standard

Drive Strength

RPULL-DOWN (Ω)

RPULL-UP (Ω)

3.3 V LVTTL / 3.3 V LVCMOS

2 mA

100

300

4 mA

100

300

6 mA

150

8 mA

150

12 mA

16 mA

24 mA

3.3 V LVCMOS Wide Range4

100 µA

Same as regular

3.3 V LVCMOS

Same as regular

3.3 V LVCMOS

2.5 V LVCMOS

2 mA

100

200

4 mA

100

200

6 mA

100

8 mA

100

12 mA

16 mA

24 mA

1.8 V LVCMOS

2 mA

200

225

4 mA

100

112

6 mA

8 mA

12 mA

16 mA

1.5 V LVCMOS

2 mA

200

224

4 mA

100

112

6 mA

8 mA

12 mA

3.3 V PCI/PCI-X

Per PCI/PCI-X

specification

Notes:

1. These maximum values are provided for informational reasons only. Minimum output buffer resistance

values depend on VCCI, drive strength selection, temperature, and process. For board design

considerations and detailed output buffer resistances, use the corresponding IBIS models located at

http://www.microsemi.com/soc/download/ibis/default.aspx.

2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec

3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec

4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD-8B

specification.

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