IO13PDB0V0 datasheet(103/197 Pages) MICROSEMI

103 / 197 page

SmartFusion Customizable System-on-Chip (cSoC)

Re vi s i on 12

2 - 91

tSU;STO

STOP setup time 3

–

pclk cycles

tFILT

Maximum spike width filtered

–

Figure 2-48 • I2C Timing Parameter Definition

Table 2-101 • I2C Characteristics

Commercial Case Conditions: TJ = 85ºC, VDD = 1.425 V, –1 Speed Grade (continued)

Parameter

Definition

Condition

Value

Unit

Notes:

1. These maximum values are provided for information only. Minimum output buffer resistance values depend on

VCCxxxxIOBx, drive strength selection, temperature, and process. For board design considerations and detailed output

buffer resistances, use the corresponding IBIS models located on the SoC Products Group website at

http://www.microsemi.com/index.php?option=com_microsemi&Itemid=489&lang=en&view=salescontact.

2. These values are provided for a load of 100 pF and 400 pF. For board design considerations and detailed output buffer

resistances,

use

the

corresponding

IBIS

models

located

the

SoC

Products

Group

website

http://www.microsemi.com/index.php?option=com_microsemi&Itemid=489&lang=en&view=salescontact.

3. For allowable Pclk configurations, refer to the Inter-Integrated Circuit (I2C) Peripherals section in the SmartFusion

Microcontroller Subsystem User’s Guide.

SCL

RISE

FALL

LOW

HD;STA

SDA

HIGH

HD;DAT

SU;DAT

SU;STO

SU;STA

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