IO13PDB0V0 datasheet(19/197 Pages) MICROSEMI

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SmartFusion Customizable System-on-Chip (cSoC)

Re vi s i on 12

2 - 7

Thermal Characteristics

Introduction

The temperature variable in the SoC Products Group Designer software refers to the junction

temperature, not the ambient, case, or board temperatures. This is an important distinction because

dynamic and static power consumption will cause the chip's junction temperature to be higher than the

ambient, case, or board temperatures. EQ 1 through EQ 3 give the relationship between thermal

resistance, temperature gradient, and power.

EQ 1

EQ 2

EQ 3

where

θJA = Junction-to-air thermal resistance

θJB = Junction-to-board thermal resistance

θJC = Junction-to-case thermal resistance

= Junction temperature

TA = Ambient temperature

TB = Board temperature (measured 1.0 mm away from the

package edge)

TC = Case temperature

= Total power dissipated by the device

Table 2-6 • Package Thermal Resistance

Product

θJA

θJC

θJB

Units

Still Air

1.0 m/s

2.5 m/s

A2F200M3F-FG256

33.7

30.0

28.3

9.3

24.8

°C/W

A2F200M3F-FG484

21.8

18.2

16.7

7.7

16.8

°C/W

A2F200M3F-CS288

26.6

20.2

18.1

7.3

9.4

°C/W

A2F200M3F-PQG208I

38.5

34.6

33.1

0.7

31.6

°C/W

θJA

TJ θA

–

------------------

θJB

TJ TB

–

-------------------

θJC

TJ TC

–

-------------------

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