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MPC7457 데이터시트(PDF) 47 Page - Freescale Semiconductor, Inc |
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MPC7457 데이터시트(HTML) 47 Page - Freescale Semiconductor, Inc |
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47 / 71 page ![]() Package Description MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8 Freescale Semiconductor 47 8.4 Package Parameters for the MPC7457, 483 CBGA or RoHS BGA The package parameters are as provided in the following list. The package type is 29 × 29 mm, 483 ceramic ball grid array (CBGA). Package outline 29 × 29 mm Interconnects 483 (22 × 22 ball array – 1) Pitch 1.27 mm (50 mil) Minimum module height — Maximum module height3.22 mm Ball diameter 0.89 mm (35 mil) |
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