MPC7457 datasheet(65/71 Pages) FREESCALE

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Part Numbering and Marking

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8

Freescale Semiconductor

Figure 30. Recommended Thermal Model of MPC7447 and MPC7457

10 Part Numbering and Marking

Ordering information for the parts fully covered by this specification document is provided in

Section 10.1, “Part Numbers Fully Addressed by This Document.” Note that the individual part numbers

correspond to a maximum processor core frequency. For available frequencies, contact your local

Freescale sales office. In addition to the processor frequency, the part numbering scheme also includes an

application modifier which may specify special application conditions. Each part number also contains a

revision level code which refers to the die mask revision number. Section 10.2, “Part Numbers Not Fully

Addressed by This Document,” lists the part numbers which do not fully conform to the specifications of

this document. These special part numbers require an additional document called a referred to as a

hardware specification addendum.

10.1

Part Numbers Fully Addressed by This Document

Table 22 provides the Freescale part numbering nomenclature for the MPC7457.

Bump and Underfill

Die

Substrate

Solder and Air

Die

Substrate

Side View of Model (Not to Scale)

Top View of Model (Not to Scale)

Conductivity

Value

Unit

Bump and Underfill

0.6

W/(m • K)

0.6

Substrate

k18

Solder Ball and Air

0.034

3.8

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