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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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AS3709 데이터시트(PDF) 7 Page - ams AG |
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AS3709 데이터시트(HTML) 7 Page - ams AG |
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7 / 74 page  ams Datasheet, Confidential: 2013-Aug [1-02] AS3709 – 7 Abs o lute M a ximum R a tings Note(s) and/or Footnote(s): 1. Depending on actual PCB layout and PCB used. 2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non hermetic Solid State Surface Mount Devices Temperature (Soldering) TBODY Package Body Temperature +260 °C 32-pin QFN: Norm IPC/JEDEC J-STD-020 (2) The lead finish for Pb-free leaded packages is matte tin (100% Sn) TBODY Package Body Temperature +260 °C 36-ball WL-CSP: Norm IPC/JEDEC J-STD-020 (2) MSLQFN Moisture Sensitive Level 3 Represents a maximum floor life time of 168h MSLWL-CSP Moisture Sensitive Level 1 Represents an unlimited floor life time Symbol Parameter Min Max Units Comments |
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