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DIM400GDM33-F000 데이터시트(PDF) 3 Page - Dynex Semiconductor |
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DIM400GDM33-F000 데이터시트(HTML) 3 Page - Dynex Semiconductor |
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3 / 8 page ![]() DIM400GDM33-F000 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 3/8 www.dynexsemi.com ELECTRICAL CHARACTERISTICS Tcase = 25°C unless stated otherwise. Symbol Parameter Test Conditions Min Typ Max Units ICES Collector cut-off current VGE = 0V, VCE = VCES 2 mA VGE = 0V, VCE = VCES, Tcase = 125°C 30 mA IGES Gate leakage current VGE = ± 20V, VCE = 0V 1 μA VGE(TH) Gate threshold voltage IC = 40mA, VGE = VCE 5.5 6.5 7.0 V VCE(sat) † Collector-emitter saturation voltage VGE = 15V, IC = 400A 2.8 V VGE = 15V, IC = 400A, Tj = 125°C 3.6 V IF Diode forward current DC 400 A IFM Diode maximum forward current tp = 1ms 800 A VF † Diode forward voltage IF = 400A 2.9 V IF = 400A, Tj = 125°C 3.0 V Cies Input capacitance VCE = 25V, VGE = 0V, f = 1MHz 72 nF Qg Gate charge ±15V 10 μC Cres Reverse transfer capacitance VCE = 25V, VGE = 0V, f = 1MHz 1.1 nF LM Module inductance 25 nH RINT Internal transistor resistance 260 μ SCData Short circuit current, ISC Tj = 125°C, VCC = 2500V tp ≤ 10μs, VGE ≤ 15V VCE (max) = VCES – L * x dI/dt IEC 60747-9 1850 A Note: † Measured at the power busbars, not the auxiliary terminals * L is the circuit inductance + LM |
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