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AN2674 데이터시트(PDF) 13 Page - STMicroelectronics

부품명 AN2674
상세설명  PCB layout guidelines for SPEAr3xx
PDF  22 Pages
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AN2674
USB interface
Doc ID 14204 Rev 2
13/22
3
USB interface
3.1
USB routing
USB signal trace routing should follow good high speed PCB rules and meet the
specifications for differential impedance and maximum trace delay between connector and
the SPEAr3xx device.
●
USB data traces should be routed with the shortest most direct path possible to their
connectors.
●
USB data traces should have no resistors or magnetic components.
●
USB data traces should be routed only over ground planes.
●
USB data traces should never cross gaps or breaks in the return plane.
●
USB data traces should never be routed under other devices or between the pins of
other devices.
●
USB data vias should be widely separated from other signal vias.
●
If USB data traces transition layers to a different return plane, then ground vias for the
return current should be placed very close to the signal vias.
Figure 4.
Cross section of PCB showing minimum spacing dimensions for USB
signal traces
Table 3.
USB signal routing constraints
Symbol
Description
Min
Typ
Max
Units
ZODiff
Differential impedance(1)
1.
Trace delay between SPEAr and USB connector (Universal Serial Bus Specification, Revision 2.0)
81
90
99
Ω
td_Dev
Trace delay of device port(1)
1.0
ns
td_Host
Trace delay of host port(1)
3.0
ns
td_match
Trace length mismatch
0.15/3.8
inch/mm
Number or length of stubs
0
Number of via transitions
1
Space to adjacent signal traces(2)
2.
This includes other USB data trace pairs.
3h(3)
3.
The unit 'h' is the thickness of the dielectric separating the trace from the nearest plane.
Space to adjacent area fill(4)
4.
Do not use "guard" traces or ground flood/fill adjacent to high speed signal traces.
3h(3)
Space to edge of return plane
20
h(3)



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