UPD78P324LP datasheet(69/80 Pages) NEC

69 / 80 page

µPD78P324, 78P324(A)

RECOMMENDED SOLDERING CONDITIONS

Please solder the package of this product under the conditions recommended as follows.

For details of the recommended conditions for soldering, please refer to the information document

“Semiconductor Device Mounting Technology Manual” (IEI-1207).

For soldering methods and conditions other than those recommended below, please contact NEC sales

personnel.

Table 9-1. Soldering Conditions for Surface-Mount Type (1)

µPD78P324GJ-5BJ

: 74-pin plastic QFP (20 x 20 mm)

µPD78P324LP

: 68-pin plastic QFJ (s

s 950 mil)

µPD78P324LP(A)

: 68-pin plastic QFJ (s

s 950 mil)

µPD78P324LP(A1)

: 68-pin plastic QFJ (s

s 950 mil)

µPD78P324LP(A2)

: 68-pin plastic QFJ (s

s 950 mil)

Soldering Method

Soldering Condition

Infrared reflow

Package peak temperature : 230

°C; time : within 30 secs (210 °C or more);

count: once; day limit : 7 daysNote (hereafter, pre-baked for 36 hrs at 125

°C)

VPS

Package peak temperature : 215

°C; time : within 40 secs (200 °C or more);

count: once; day limit : 7 daysNote (hereafter, pre-baked for 36 hrs at 125

°C)

Wave soldering

Solder bath temperature: no more than 260

°C; time : within 10 secs; count:

once; preheating temperature : 120

°C max. (package surface temperature);

day limit : 7 daysNote (hereafter, pre-baked for 36 hours at 125

°C)

Pin part heating

Pin temperature : no more than 300

°C; time : within 3 secs (per device side)

Recommended

Condition Symbol

IR30-367-1

VP15-367-1

WS60-367-1

—

Note

Refers to the number of days for storage after the dry pack is opened. The storage conditions are 25

°C

and no more than 65 %RH.

Caution

Avoid using multiple soldering methods at the same time (except the pin part heating method).

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