LP38853_15 datasheet(5/28 Pages) TI

5 / 28 page

LP38853

www.ti.com

SNVS335D – DECEMBER 2006 – REVISED APRIL 2013

Electrical Characteristics (continued)

Unless otherwise specified: VOUT = 0.80V, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VEN = VBIAS, IOUT = 10 mA, CIN = COUT = 10 µF,

CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction

temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical

correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes

only.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

AC Parameters

VIN = VOUT(NOM) + 1V,

f = 120 Hz

PSRR

Ripple Rejection for VIN Input

(VIN)

Voltage

VIN = VOUT(NOM) + 1V,

f = 1 kHz

VBIAS = VOUT(NOM) + 3V,

f = 120 Hz

PSRR

Ripple Rejection for VBIAS Voltage

(VBIAS)

VBIAS = VOUT(NOM) + 3V,

f = 1 kHz

Output Noise Density

f = 120 Hz

µV/

√Hz

BW = 10 Hz

− 100 kHz

150

Output Noise Voltage

µVRMS

BW = 300 Hz

− 300 kHz

Thermal Parameters

Thermal Shutdown Junction

TSD

160

Temperature

°C

TSD(HYS)

Thermal Shutdown Hysteresis

PFM

Thermal Resistance, Junction to

θJ-A

DDPAK-7

Ambient(5)

SO PowerPAD-8

168

°C/W

PFM-7

Thermal Resistance, Junction to

θJ-C

DDPAK-7

Case(5) (6)

SO PowerPAD-8

(5)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (

θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

(6)

For PFM and DDPAK:

θJ-C refers to the BOTTOM surface of the package, under the epoxy body, as the 'CASE'. For SO PowerPAD-8:

θJ-C refers to the DAP (aka: Exposed Pad) on BOTTOM surface of the package as the 'CASE'.

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