LP38853_15 datasheet(3/28 Pages) TI

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LP38853

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SNVS335D – DECEMBER 2006 – REVISED APRIL 2013

PIN DESCRIPTIONS (continued)

SO PowerPAD-

PFM-7

DDPAK-7

Pin Description

Pin #

Symbol

Pin #

The SO PowerPAD DAP is a thermal connection only that is

physically attached to the backside of the die, and used as a

DAP

thermal heat-sink connection. See the Application Information

section for details.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Storage Temperature Range

−65°C to +150°C

Lead Temperature Soldering, 5 seconds

260°C

ESD Rating

Human Body Model(3)

±2 kV

Power Dissipation(4)

Internally Limited

VIN Supply Voltage (Survival)

−0.3V to +6.0V

VBIAS Supply Voltage (Survival)

−0.3V to +6.0V

VSS SoftStart Voltage (Survival)

−0.3V to +6.0V

VOUT Voltage (Survival)

−0.3V to +6.0V

IOUT Current (Survival)

Internally Limited

Junction Temperature

−40°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114.

(4)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (

θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

Operating Ratings

(1)

VIN Supply Voltage

(VOUT + VDO) to VBIAS

VBIAS Supply Voltage

0.8V

≤ VOUT ≤ 1.2V

3.0V to 5.5V

1.2V < VOUT ≤ 1.8V

4.5V to 5.5V

VEN Voltage

0.0V to VBIAS

IOUT

0 mA to 3.0A

Junction Temperature Range(2)

−40°C to +125°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,

see the Electrical Characteristics.

(2)

Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to

ambient thermal resistance (

θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

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