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AR0134CSSC00SUEAH-GEVB 데이터시트(PDF) 38 Page - ON Semiconductor

부품명 AR0134CSSC00SUEAH-GEVB
상세설명  Inch 1.2 Mp CMOS Digital Image Sensor with Global Shutter
PDF  41 Pages
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제조업체  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

AR0134CSSC00SUEAH-GEVB 데이터시트(HTML) 38 Page - ON Semiconductor

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Package Dimensions
Figure 25:
63-Ball iBGA Package Outline Drawing
Notes:
1. Dimensions in mm. Dimensions in () are for reference only.
Encapsulant: Epoxy.
Substrate material: Plastic laminate 0.25 thickness.
Lid material: Borosilicate glass 0.4 ± 0.04 thickness.
Refractive index at 20C = 1.5255 @ 546nm and 1.5231 @ 588nm.
Double side AR Coating: 530-570nm R< 1%; 420-700nm R < 2%.
Image sensor die: 0.2mm thickness.
Solder ball material: SAC305 (95% Sn, 3% Ag, 0.5% Cu).
Dimensions apply to solder balls post reflow.
Pre-flow ball is0.5 on a Ø0.4 SMD ball pad.
Maximum rotation of optical area relative to package edges: 1°.
Maximum tilt of optical area relative to substrate plane
: 25 m.
Maximum tilt of cover glass relative to optical area plane
: 50 m.
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