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LNBH25S 데이터시트(PDF) 16 Page - STMicroelectronics |
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LNBH25S 데이터시트(HTML) 16 Page - STMicroelectronics |
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16 / 37 page ![]() Typical application circuits LNBH25S 16/37 DocID026736 Rev 2 5 Typical application circuits Figure 6: DiSEqC 1.x application circuit Table 5: DiSEqC 1.x bill of material Component Notes R1 (RSEL) SMD resistor. Refer to Table 13: "Electrical characteristics" and ISEL pin description in Table 2: "Pin description" C1 > 25 V electrolytic capacitor, 100 µF or higher is suitable or > 25 V ceramic capacitor, 10 µF or higher is suitable C2 With COMP = 0, > 25 V electrolytic capacitor, 100 µF or higher is suitable or with COMP = 1, > 35 V ceramic capacitor, 22 µF (or 2 x 10 µF) or higher is suitable C3 From 470 nF to 2.2 µF ceramic capacitor placed as closer as possible to VUP pins. Higher values allow lower DC-DC noise C5 From 100 nF to 220 nF ceramic capacitor placed as close as possible to VOUT pins. Higher values allow lower DC-DC noise C4, C7 220 nF ceramic capacitors. To be placed as close as possible to VOUT pin D1 STPS130A or similar Schottky diode D2 1N4001-07, S1A-S1M, or any similar general purpose rectifier D3 BAT54, BAT43, 1N5818, or any low power Schottky diode with IF(AV) > 0.2 A, VRRM > 25 V, VF < 0.5 V. To be placed as close as possible to VOUT pin |
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