TDA8029C2 datasheet(2/58 Pages) PHILIPS

2 / 58 page

2003 Oct 30

Philips Semiconductors

Product speciﬁcation

Low power single card reader

TDA8029

CONTENTS

FEATURES

GENERAL DESCRIPTION

APPLICATIONS

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

8.1

Microcontroller

8.1.1

Port characteristics

8.1.2

Oscillator characteristics

8.1.3

Reset

8.1.4

Low power modes

8.2

Timer 2 operation

8.2.1

Timer/counter 2 Control register (T2CON)

8.2.2

Timer/counter 2 Mode control register

(T2MOD)

8.2.3

Auto-reload mode (up- or down-counter)

8.2.4

Baud rate generator mode

8.2.5

Timer/counter 2 set-up

8.3

Enhanced UART

8.3.1

Serial port Control register (SCON)

8.3.2

Automatic address recognition

8.4

Interrupt priority structure

8.4.1

Interrupt Enable (IE) register

8.4.2

Interrupt Priority (IP) register

8.4.3

Interrupt Priority High (IPH) register

8.5

Dual Data Pointer (DPTR)

8.6

Expanded data RAM addressing

8.6.1

Auxiliary Register (AUXR)

8.7

Reduced EMI mode

8.8

Mask ROM devices

8.9

ROM code submission for 16 kbytes ROM

device TDA8029

8.10

Smart card reader control registers

8.10.1

General registers

8.10.1.1

Card Select Register (CSR)

8.10.1.2

Hardware Status Register (HSR)

8.10.1.3

Time-Out Registers (TOR1, TOR2 and TOR3)

8.10.1.4

Time-Out Configuration register (TOC)

8.10.2

ISO UART registers

8.10.2.1

UART Transmit Register (UTR)

8.10.2.2

UART Receive Register (URR)

8.10.2.3

Mixed Status Register (MSR)

8.10.2.4

FIFO Control Register (FCR)

8.10.2.5

UART Status Register (USR)

8.10.3

Card registers

8.10.3.1

Programmable Divider Register (PDR)

8.10.3.2

UART Configuration Register 2 (UCR2)

8.10.3.3

Guard Time Register (GTR)

8.10.3.4

UART Configuration Register 1 (UCR1)

8.10.3.5

Clock Configuration Register (CCR)

8.10.3.6

Power Control Register (PCR)

8.10.4

8.11

Supply

8.12

DC/DC converter

8.13

ISO 7816 security

8.14

Protections and limitations

8.15

Power reduction modes

8.16

Activation sequence

8.17

Deactivation sequence

LIMITING VALUES

HANDLING

THERMAL CHARACTERISTICS

CHARACTERISTICS

APPLICATION INFORMATION

PACKAGE OUTLINE

SOLDERING

15.1

Introduction to soldering surface mount

packages

15.2

Reflow soldering

15.3

Wave soldering

15.4

Manual soldering

15.5

Suitability of surface mount IC packages for

wave and reflow soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

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