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UCD3138128APFC 데이터시트(PDF) 73 Page - Texas Instruments

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부품명 UCD3138128APFC
상세설명  UCD3138128A Highly-Integrated Digital Controller For Isolated Power
PDF  83 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
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UCD3138128A
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SLUSC99 – JULY 2016
Product Folder Links: UCD3138128A
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Copyright © 2016, Texas Instruments Incorporated
11 Power Supply Recommendations
•
Both 3.3 VD and 3.3 VA should have a local capacitor of at least 4.7-µF in parallel with a 10-nF capacitor
placed as close as possible to the device pins.
•
BP18 should have a 1-µF capacitor in parallel with a 10-nF capacitor to ground.
For detailed practical design guidelines, refer to (SLUA779).
12 Layout
12.1 IC Grounding and Layout Guidelines
•
Single ground is recommended: SGND. A multilayer such as 4 layers board is recommended so that one
solid SGND is dedicated for return current path, referred to the layout example.
•
Apply multiple different capacitors for different frequency range on decoupling circuits. Each capacitor has
different ESL, Capacitance and ESR, and they have different frequency response.
•
Avoid long traces close to radiation components, and place them into an internal layer, and it is preferred to
have grounding shield.
•
Analog circuits and digital circuits should have separate return to ground; although with a single plane, still try
to avoid mixing analog current and digital current.
•
Do not use a ferrite bead or larger than 3 Ω resistor to connect between V33A and V33D.
•
Both 3.3VD and 3.3VA should have local decoupling capacitors close to the device power pins, add vias to
connect decoupling caps directly to SGND.
•
Avoid negative current/negative voltage on all pins, so Schottky clamping diodes may be needed to limit the
voltage; avoid more than 3.8 V or less than –0.3 V voltage spikes on all pins; add Schottky diodes on the pins
which could have voltage spikes during surge test; be aware that a Schottky has relatively higher leakage
current, which can affect the voltage sensing at high temperature.
•
RESET pin should have one at least 2.2 µF low ESL capacitor locally decoupled with SGND plane. This
capacitor must be located close to the device RESET pin. It is highly recommended to use a small resistance
(such as 220 Ω) to connect the RESET pin with 3.3 VD.
•
If the XTAL_IN (Pin 61) and XTAL_OUT (Pin 62) are not used for external clock, tie them to 1.8V (Pin BP18)
through a 1k
Ω resistor respectively.
For detailed practical design guidelines, refer to (SLUA779).



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