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MCP2200T-I/SS 데이터시트(PDF) 34 Page - Microchip Technology

부품명 MCP2200T-I/SS
상세설명  USB 2.0 to UART Protocol Converter with GPIO
PDF  44 Pages
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제조업체  MICROCHIP [Microchip Technology]
홈페이지  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP2200T-I/SS 데이터시트(HTML) 34 Page - Microchip Technology

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MCP2200
DS20002228C-page 34
 2011-2015 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Microchip Technology Drawing C04-2139B (MQ)
20-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x1.0 mm Body [VQFN]
SILK SCREEN
1
2
20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C1
Optional Center Pad Width
Contact Pad Spacing
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
C2
T2
W2
3.35
3.35
MILLIMETERS
0.65 BSC
MIN
E
MAX
4.50
4.50
Contact Pad Length (X20)
Contact Pad Width (X20)
Y1
X1
0.55
0.40
G
Distance Between Pads
0.20
NOM
With 0.40 mm Contact Length
C1
C2
EV
EV
E
X2
Y2
ØV
G
Y1
X1



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