STM32F756VG datasheet(137/228 Pages) STMICROELECTRONICS

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STM32F756xx

Electrical characteristics

196

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It should be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Therefore it is recommended that the user applies EMC software optimization and

prequalification tests in relation with the EMC level requested for his application.

Software recommendations

The software flowchart must include the management of runaway conditions such as:

•

Corrupted program counter

•

Unexpected reset

•

Critical Data corruption (control registers...)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1

second.

To complete these trials, ESD stress can be applied directly on the device, over the range of

specification values. When unexpected behavior is detected, the software can be hardened

to prevent unrecoverable errors occurring (see application note AN1015).

Electromagnetic Interference (EMI)

The electromagnetic field emitted by the device are monitored while a simple application,

executing EEMBC code, is running. This emission test is compliant with SAE IEC61967-2

standard which specifies the test board and the pin loading.

Table 52. EMI characteristics

Symbol Parameter

Conditions

Monitored

frequency band

Max vs.

[fHSE/fCPU] Unit

25/200 MHz

SEMI

Peak level

VDD = 3.6 V, TA = 25 °C, TFBGA216 package,

conforming to IEC61967-2 ART/L1-cache OFF,

over-drive ON, all peripheral clocks enabled, clock

dithering disabled.

0.1 to 30 MHz

- 4

dBµV

30 to 130 MHz

130 MHz to 1GHz

EMI Level

VDD = 3.6 V, TA = 25 °C, TFBGA216 package,

conforming to IEC61967-2 ART/L1-cache ON,

over-drive ON, all peripheral clocks enabled, clock

dithering disabled.

0.1 to 30 MHz

dBµV

30 to 130 MHz

130 MHz to 1GHz

EMI level

VDD = 3.6 V, TA = 25 °C, TFBGA216 package,

conforming to IEC61967-2 ART/L1-cache ON,

over-drive ON, all peripheral clocks enabled, clock

dithering enabled.

0.1 to 30 MHz

- 9

dBµV

30 to 130 MHz

-7

130 MHz to 1GHz

-5

EMI level

1.5

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