TLE7233EM datasheet(11/33 Pages) INFINEON

11 / 33 page

Data Sheet

Rev. 1.2, 2014-05-09

SPI Driver for Enhanced Relay Control

SPIDER - TLE7233EM

General Product Characteristics

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards.

For more information, go to www.jedec.org.

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

4.3.6

Junction to Case, bottom

thJC,back

–

–4K/W

– 1) 2)

1) Not test subject to production test, specified by design

2) Specified RthJC value is simulated at natural convection on a cold plate setup (all pins are fixed to ambient temperature).

TA = 85 °C. Ch0 to Ch3 are dissipating 1 W power (0.25 W each).

4.3.7

Junction to Case, top

thJC,top

––

K/W

– 1) 2)

4.3.8

Junction to Pin (6,7,18 or 19)

thJPin

––

K/W

– 1) 2)

4.3.9

Junction to Ambient

(1s0p, min. footprint)

thJA,min

–95

–

K/W

– 1) 3)

3) Specified RthJA value is according to JEDEC JESD51-2,-3 at natural convection on FR4 1s0p board; The product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with minimal footprint copper area and 70 µm thickness.

TA = 85 °C. Ch0 to Ch3 are dissipating 1 W power (0.25 W each).

4.3.10

Junction to Ambient

(1s0p + 300mm2 Cu)

thJA,300

–52

–

K/W

– 1) 4)

4) Specified RthJA value is according to JEDEC JESD51-2,-3 at natural convection on FR4 1s0p board; The product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional heatspreading copper area of 300 mm2

and 70 µm thickness. TA = 85 °C. Ch0 to Ch3 are dissipating 1 W power (0.25 W each).

4.3.11

Junction to Ambient

(1s0p + 600mm2 Cu)

thJA,600

–45

–

K/W

– 1) 5)

5) Specified RthJA value is according to JEDEC JESD51-2,-3 at natural convection on FR4 1s0p board; The product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional heatspreading copper area of 600 mm2

and 70 µm thickness. TA = 85°C. Ch0 to Ch3 are dissipating 1 W power (0.25 W each).

4.3.12

Junction to Ambient (2s2p)

thJA,2s2p

–33

–

K/W

– 1) 6)

6) Specified RthJA value is according to JEDEC JESD51-2,-7 at natural convection on FR4 2s2p board; The product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu).

TA = 85°C. Ch0 to Ch3 are dissipating 1 W power (0.25 W each).

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