LP3928 datasheet(7/11 Pages) NSC

7 / 11 page

Electrical Characteristics Unless otherwise specified: H = V

IH min, L = VIL max, CVBAT = 1 µF, IOUT = 1 mA,

CVCCB = 1 µF, CVCCA = 1 µF. Typical values and limits appearing in standard typeface apply for TJ = 25˚C. Limits appearing in

boldface type apply over the entire junction temperature range for operation, −40˚C to +125˚C. (Note 9) (Continued)

LDO Electrical Characteristics (Continued)

Unless otherwise specified: EN1 = L, EN2 = H; V

OUTnom = 2.85V, VBAT =VOUT(nom) + 0.5V.

Symbol

Parameter

Conditions

Typical

Limit

Units

Min

Max

PSRR

Power Supply Rejection Ratio

(Note 29)

BAT =VOUT(nom) + 1V,

f = 1 kHz, I

OUT = 50 mA, (Figure 2)

BAT =VOUT(nom) + 1V,

f = 50 kHz, I

OUT = 50 mA, (Figure 2)

Quiescent Current

OUT = 1mA

150

µA

OUT = 1 mA to 150 mA

130

200

∆V

Dropout Voltage (Note 22)

OUT = 1 mA

0.4

OUT =50 mA

OUT = 100 mA

OUT = 150 mA

100

Short Circuit Current Limit

BAT = 6V, Output Grounded (Steady

State)

500

OUT(PK)

Peak Output Current

OUT

≥ V

OUT(nom) − 5%, VBAT = 6V

460

200

Turn-On Time (Note 23) (Note

29)

200

130

430

µs

ρn (1/f)

Output Noise Density

f = 1 kHz, C

OUT = 1 µF

0.6

µV/

√Hz

Output Noise Voltage

BW = 10 Hz to 100 kHz, C

OUT = 1 µF

µVrms

Output

Capacitor

Output Filter Capacitance

(Note 24)

BAT = 3.05V to 6V,

OUT = 1mA to 150 mA

122

µF

Output Filter Capacitance ESR

(Note 25)

BAT = 3.05V to 6V,

OUT = 1mA to 150 mA

500

Ω

Thermal

Shutdown

Thermal Shutdown Temperature

(Note 26)

160

˚C

Thermal Shutdown Hysteresis

˚C

Note 3: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device

is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test condition, see Electrical

Characteristics tables.

Note 4: All voltages are with respect to the potential at the GND pin.

Note 5: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula

P= (T

J −TA)/

JA,

(1)

Where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. The 360 mW rating appearing under

Absolute Maximum Ratings results from substituting the Absolute Maximum junction temperature, 150˚C, for TJ, 85˚C for TA, and 180˚C/W for θJA. More power can

be dissipated safely at ambient temperatures below 85˚C. The thermal resistance can be better or worse than 180˚C/W depending on board layout. Larger copper

planes and thermal vias should be used to conduct heat away from the micro SMD solder bumps.

Note 6: The Human Body Model is 100 pF discharged through 1.5 k

Ω resistor into each pin.

Note 7: VCCB can be supplied from an external voltage source in the range of 1.65V to 3.6V, as long as both VBAT and VCCB are connected to the external source.

Only the LDO quiescent current (see DC electrical specifications) will add to the level-shifter current consumption. This Operating Rating does not imply guaranteed

performance. For guaranteed performance limits and associated test conditions, see Electrical Characteristics tables.

Note 8: Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 220 mW rating

appearing under Operating Ratings results from substituting the maximum junction temperature for operation, 125˚C, for TJ, 85˚C for TA, and 180˚C/W for θJA into

(1) above. More power can be dissipated at ambient temperatures below 85˚C. The thermal resistance can be better or worse than 180˚C/W depending on board

layout. Larger copper planes and thermal vias should be used to conduct heat away from the micro SMD solder bumps.

Note 9: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with TJ = 25˚C or correlated using

Statistical Quality Control (SQC) methods. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations

and applying statistical process control.

Note 10: The target output voltage, which is labeled VOUT(target), is the desired or ideal output voltage. The nominal output voltage, which is labeled VOUT(nom),is

the output voltage measured with the input 0.5V above VOUT(target) anda1mA load.

Note 11: Input leakage current for pins DIRi, EN1, EN2.

Note 12: Input leakage current for pins Bi, LatchClk.

Note 13: This is the static current consumption from VCCB for channel (i) when DIRi=H (A→B direction).

Note 14: This is the static current consumption from VCCB for channel (i) when DIRi=L (B→A direction).

Note 15: This is the static current consumption from VCCB for the part common to the channels.

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