TMP93CS40DF datasheet(18/48 Pages) TOSHIBA

18 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-18

2002-02-20

(5)

870/X Series

Table 2.7

Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method

Products

Name

Package no.

Air reflow

Infrared reflow

TMP88CK48F

P-QFP64-1420-1.00A

A(168h)

TMP88CM48F

P-QFP64-1420-1.00A

A(168h)

TMP88CS48AF

P-QFP64-1420-1.00A

B(72h)

TMP88CK49F

P-QFP64-1420-1.00A

A(168h)

TMP88CM49F

P-QFP64-1420-1.00A

A(168h)

TMP88PS49F

P-QFP64-1420-1.00A

B(72h)

TMP88C060F

P-LQFP80-1212-0.50A

A(168h)

TMP88CU74F

P-QFP80-1420-0.80B

A(168h)

TMP88PU74F

P-QFP80-1420-0.80B

B(72h)

TMP88CP76F

P-QFP80-1420-0.80B

A(168h)

TMP88CS76F

P-QFP80-1420-0.80B

A(168h)

TMP88PS76F

P-QFP80-1420-0.80B

B(72h)

TMP88CP77F

P-QFP100-1420-0.65A

B(72h)

TMP88CS77F

P-QFP100-1420-0.65A

A(168h)

TMP88PU77F

P-QFP100-1420-0.65A

B(72h)

Note 1:

As of March, 2001

Note 2:

Symbols A (168h), B (72h), C (48h), D (24h), E(12h),

G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device.

For

details of these conditions, please refer to Table 2.2.

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