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TMP93CS40DF 데이터시트(PDF) 29 Page - Toshiba Semiconductor

부품명 TMP93CS40DF
상세설명  Quality And Reliability Assurance / Handling Precautions
PDF  48 Pages
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제조업체  TOSHIBA [Toshiba Semiconductor]
홈페이지  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TMP93CS40DF 데이터시트(HTML) 29 Page - Toshiba Semiconductor

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Quality and Reliability Assurance / Handling Precautions
030901
QUA-29
2002-02-20
(5)
Pay attention to the following points when using automatic
equipment in your workplace:
(a)
When picking up ICs with a vacuum unit, use a conductive
rubber fitting on the end of the pick-up wand to protect against
electrostatic charge.
(b)
Minimize friction on IC package surfaces. If some rubbing is
unavoidable due to the device’s mechanical structure,
minimize the friction plane or use material with a small
friction coefficient and low electrical resistance. Also consider
the use of an ionizer.
(c)
In sections that come into contact with device lead terminals,
use a material which dissipates static electricity.
(d)
Ensure that no statically charged bodies (such as work clothes
or the human body) touch the devices.
(e)
Make sure that sections of the tape carrier which come into
contact with installation devices or other electrical machinery
are made of a low-resistance material.
(f)
Make sure that jigs and tools used in the assembly process do
not touch devices.
(g)
In processes in which packages may retain an electrostatic
charge, use an ionizer to neutralize the ions.
(6)
Make sure that CRT displays in the working area are protected
against static charge, for example by a VDT filter. As much as
possible, avoid turning displays on and off. Doing so can cause
electrostatic induction in devices.
(7)
Keep track of charged potential in the working area by taking
periodic measurements.
(8)
Ensure that work chairs are protected by an anti-static textile cover
and are grounded to the floor surface by a grounding chain.
(Suggested resistance between the seat surface and grounding
chain is 7.5
× 105 to 1012 Ω.)
(9)
Install anti-static mats on storage shelf surfaces. (Suggested
surface resistivity is 10
4 to 108
Ω/sq; suggested resistance between
surface and ground is 7.5
× 105 to 108 Ω.)
(10) For transport and temporary storage of devices, use containers
(boxes, jigs or bags) that are made of anti-static materials or
materials which dissipate electrostatic charge.
(11) Make sure that cart surfaces which come into contact with device
packaging are made of materials which will conduct static
electricity, and verify that they are grounded to the floor surface via
a grounding chain.
(12) In any location where the level of static electricity is to be closely
controlled, the ground resistance level should be Class 3 or above.
Use different ground wires for all items of equipment which may
come into physical contact with devices.



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