전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

ST7MC1K2 데이터시트(PDF) 355 Page - STMicroelectronics

부품명 ST7MC1K2
상세설명  Clock, reset and supply management
PDF  371 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST7MC1K2 데이터시트(HTML) 355 Page - STMicroelectronics

Back Button ST7MC1K2 Datasheet HTML 351Page - STMicroelectronics ST7MC1K2 Datasheet HTML 352Page - STMicroelectronics ST7MC1K2 Datasheet HTML 353Page - STMicroelectronics ST7MC1K2 Datasheet HTML 354Page - STMicroelectronics ST7MC1K2 Datasheet HTML 355Page - STMicroelectronics ST7MC1K2 Datasheet HTML 356Page - STMicroelectronics ST7MC1K2 Datasheet HTML 357Page - STMicroelectronics ST7MC1K2 Datasheet HTML 358Page - STMicroelectronics ST7MC1K2 Datasheet HTML 359Page - STMicroelectronics Next Button
Zoom Inzoom in Zoom Outzoom out
 355 / 371 page
background image
Obsolete
Product(s)
- Obsolete
Product(s)
ST7MC1K2-Auto, ST7MC1K6-Auto, ST7MC2S4-Auto, ST7MC2S6-Auto
Package characteristics
355/371
13.2.3
Thermal characteristics
13.2.4
Soldering information
In accordance with the RoHS European directive, all STMicroelectronics packages have
been converted to lead-free technology, named ECOPACK®.
●
ECOPACK® packages are qualified according to the JEDEC STD-020C compliant
soldering profile.
●
Detailed information on the STMicroelectronics ECOPACK® transition program is
available on www.st.com/stonline/leadfree/, with specific technical application notes
covering the main technical aspects related to lead-free conversion (AN2033, AN2034,
AN2035, AN2036).
Forward compatibility
ECOPACK® LQFP packages are fully compatible with Lead (Pb) containing soldering
process (see application note AN2034)
Table 224.
Thermal characteristics
Symbol
Ratings
Value
Unit
RthJA
Package thermal resistance (junction to ambient):
– LQFP44 10x10
–LQFP32 7x7
68
80
°C/W
TJmax
Maximum junction temperature(1)
1.
The maximum chip-junction temperature is based on technology characteristics.
150
°C
PDmax
Power dissipation(2)
2.
The maximum power dissipation is obtained from the formula PD = (TJ -TA)/RthJA. The power dissipation of
an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip
internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the
application.
500
mW
Table 225.
Soldering compatibility (wave and reflow soldering process)
Package
Plating material devices
Pb solder paste
Pb-free solder paste
LQFP 32
NiPdAu (Nickel-Palladium-Gold)
Yes
Yes(1)
1.
Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label) is
compatible with their Lead-free soldering process.
LQFP 44
Sn (pure Tin)
Obsolete
Product(s)
- Obsolete
Product(s)



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com