ST72321R7-Auto datasheet(222/243 Pages) STMICROELECTRONICS

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Package characteristics

ST72321xx-Auto

222/243

Doc ID 13829 Rev 1

20.1

Thermal characteristics

20.2

Ecopack information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

20.3

Packaging for automatic handling

The devices can be supplied in trays or with tape and reel conditioning.

Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when

facing the tape sprocket holes as shown in Figure 104.

Figure 104. Pin 1 orientation in tape and reel conditioning

See also Section Figure 105.: ST72F321xxx-Auto Flash commercial product structure on

page 226 and Figure 106: ST72P321xxx-Auto FastROM commercial product structure on

page 228.

Table 139.

Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance (junction to ambient)

LQFP64

14x14

LQFP64

10x10

LQFP44

10x10

°C/W

Power dissipation(1)

The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation

of an application can be defined by the user with the formula: PD =PINT +PPORT where PINT is the chip

internal power (IDD xVDD) and PPORT is the port power dissipation depending on the ports used in the

application.

500

TJmax

Maximum junction temperature(2)

The maximum chip-junction temperature is based on technology characteristics.

150

°C

Right orientation (EIA 481-C compliant)

Left orientation

Pin 1

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