STM32L100RB datasheet(57/103 Pages) STMICROELECTRONICS

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STM32L100C6 STM32L100R8/RB

Electrical characteristics

6.3.5

Wakeup time from Low-power mode

The wakeup times given in the following table are measured with the MSI RC oscillator. The

clock source used to wake up the device depends on the current operating mode:

•

Sleep mode: the clock source is the clock that was set before entering Sleep mode

•

Stop mode: the clock source is the MSI oscillator in the range configured before

entering Stop mode

•

Standby mode: the clock source is the MSI oscillator running at 2.1 MHz

AHB

GPIOA

4.5

3.5

µA/MHz

(fHCLK)

GPIOB

4.5

3.5

4.5

GPIOC

4.5

3.5

4.5

GPIOD

4.5

3.5

4.5

GPIOH

3.5

CRC

0.5

FLASH

11.5

18.5

DMA1

10.5

All enabled

166

138

106

130

IDD (RTC)

0.47

µA

IDD (LCD)

3.1

IDD (ADC)(3)

1450

IDD (DAC)(4)

340

IDD (COMP1)

0.16

IDD (COMP2)

Slow mode

Fast mode

IDD (PVD / BOR)(5)

2.6

IDD (IWDG)

0.25

1. Data based on differential IDD measurement between all peripherals OFF an one peripheral with clock enabled, in the

following conditions: fHCLK = 32 MHz (Range 1), fHCLK = 16 MHz (Range 2), fHCLK = 4 MHz (Range 3), fHCLK = 64kHz

(Low power run/sleep), fAPB1 = fHCLK, fAPB2 = fHCLK, default prescaler value for each peripheral. The CPU is in Sleep

mode in both cases. No I/O pins toggling.

2. HSI oscillator is OFF for this measure.

3. Data based on a differential IDD measurement between ADC in reset configuration and continuous ADC conversion (HSI

consumption not included).

4. Data based on a differential IDD measurement between DAC in reset configuration and continuous DAC conversion of

VDD/2. DAC is in buffered mode, output is left floating.

5. Including supply current of internal reference voltage.

Table 23. Peripheral current consumption(1) (continued)

Peripheral

Typical consumption, VDD = 3.0 V, TA = 25 °C

Unit

Range 1,

VCORE=1.8 V

VOS[1:0] = 01

Range 2,

VCORE=1.5 V

VOS[1:0] = 10

Range 3,

VCORE=1.2 V

VOS[1:0] = 11

Low power

sleep and run

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