STM32L443CC datasheet(188/207 Pages) STMICROELECTRONICS

188 / 207 page

Package information

STM32L443CC STM32L443RC STM32L443VC

188/207

DocID028739 Rev 2

Figure 51. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid

array

package recommended footprint

Device marking

The following figure gives an example of topside marking orientation versus ball A1 identifier

location.

0.700

0.750

0.800

0.0276

0.0295

0.0315

ddd

0.080

0.0031

eee

0.150

0.0059

fff

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 94. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.460

0.530

0.600

0.0181

0.0209

0.0236

Table 95. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA)

Dimension

Recommended values

Pitch

0.5

Dpad

0.280 mm

Dsm

0.370 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.280 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Pad trace width

0.100 mm

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